JAJSLS0C June   2021  – March 2022 TLC6A598

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Waveforms
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial-In Interface
      2. 8.3.2 Clear Registers
      3. 8.3.3 Output Channels
      4. 8.3.4 Register Clock
      5. 8.3.5 Cascade Through SER OUT
      6. 8.3.6 Output Control
      7. 8.3.7 Clamping Structure
      8. 8.3.8 Protection Functions
        1. 8.3.8.1 Overcurrent Protection
        2. 8.3.8.2 Output Detection
        3. 8.3.8.3 Serial Communication Error
        4. 8.3.8.4 Thermal Shutdown
      9. 8.3.9 Interface
        1. 8.3.9.1 Register Write
        2. 8.3.9.2 Register Read
        3. 8.3.9.3 Shift-Register Communication-Fault Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With VCC < 3 V
      2. 8.4.2 Operation With 5.5 V ≤ VCC ≤ 7 V
    5. 8.5 Register Maps
      1. 8.5.1 Configuration Register(Offset=0h)[reset=0h]
      2. 8.5.2 Fault Readback Register(Offset=1h)[reset=0h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application 1
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application 2
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
    4. 9.4 Typical Application 3
      1. 9.4.1 Design Requirements
      2. 9.4.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TLC6A598 UNIT
DW (SOIC-24)
24 PINS
RθJA Junction-to-ambient thermal resistance 55.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.5 °C/W
RθJB Junction-to-board thermal resistance 30.3 °C/W
ΨJT Junction-to-top characterization parameter 7.3 °C/W
ΨJB Junction-to-board characterization parameter 30.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.