JAJSF71B April   2018  – December 2019 TLIN1024-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      概略回路図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC
    4. 6.4 Thermal Information
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  LIN (Local Interconnect Network) Bus
        1. 8.3.1.1 LIN Transmitter Characteristics
        2. 8.3.1.2 LIN Receiver Characteristics
          1. 8.3.1.2.1 Termination
      2. 8.3.2  TXD (Transmit Input/Output)
      3. 8.3.3  RXD (Receive Output)
      4. 8.3.4  VSUP1/2 (Supply Voltage)
      5. 8.3.5  GND (Ground)
      6. 8.3.6  EN (Enable Input)
      7. 8.3.7  Protection Features
      8. 8.3.8  TXD Dominant Time Out (DTO)
      9. 8.3.9  Bus Stuck Dominant System Fault: False Wake Up Lockout
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Under Voltage on VSUP
      12. 8.3.12 Unpowered Device and LIN Bus
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Sleep Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Wake Up Events
        1. 8.4.4.1 Wake Up Request (RXD)
        2. 8.4.4.2 Mode Transitions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Normal Mode Application Note
        2. 9.2.2.2 Standby Mode Application Note
        3. 9.2.2.3 TXD Dominant State Timeout Application Note
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

改訂履歴

Changes from A Revision (May 2018) to B Revision

  • 特長」の「HBM 分類レベル:±6kV」を「HBM 分類レベル:±8kV」に変更Go
  • Changed the VLOGIC MAX value From:  5.5 V To: 6 V in the Absolute Maximum Ratings.Go
  • Deleted J2962-1 ESD and ISO Pulses from ESD RatingsGo
  • Changed the HBM value from ±6000 to ±8000 in the ESD RatingsGo
  • Changed IEC 61000-4-2 to IEC 62228-2 and made three rows, two for contact and added indirect ESDGo
  • Changed ICC to ISUPGo
  • Changed the Supply Current 4 V Sleep Mode TYP values From: 20 µA To: 7 µA and the MAX value From: 40 µA To: 20 µAGo
  • Changed  the Supply Current 14 V Sleep Mode MAX value From: 60 µA To: 30 µA Go
  • Changed the CLINPIN MAX value From: 45 pF To: 25 pF Go
  • Added TEST CONDITION: VSUP = 14 V to CLINPINGo
  • Changed From ±42 V To: ±45 V in Overview Section Go
  • Cleaned up wording in Overview section second paragraph Go

Changes from * Revision (April 2018) to A Revision

  • Changed RSLAVE Typical value from 30 kΩ to 45 kΩ in the Electrical CharacteristicsGo