JAJSH90C April   2019  – November 2019 TMP235-Q1 , TMP236-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      機能ブロック図
      2.      出力電圧と周囲温度との関係
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Connection to an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連リンク
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC (1)(2) TMP23X-Q1 UNIT
DCK (SC70) DBZ (SOT-23)
5 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance(3)(4) 275 167 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84 90 °C/W
RθJB Junction-to-board thermal resistance 56 146 °C/W
ΨJT Junction-to-top characterization parameter 1.2 35 °C/W
ΨJB Junction-to-board characterization parameter 55 146 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
For information on self-heating and thermal response time seeLayout Guidelinessection.
The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.
Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.