SPRS357D August   2006  – June 2020 TMS320F28044

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for F28044 100-Ball GGM Package
    7. 5.7  Thermal Resistance Characteristics for F28044 100-Pin PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Timing and Switching Characteristics
      1. 5.9.1 Timing Parameter Symbology
        1. 5.9.1.1 General Notes on Timing Parameters
        2. 5.9.1.2 Test Load Circuit
        3. 5.9.1.3 Device Clock Table
          1. Table 5-3 TMS320x280x Clock Table and Nomenclature
      2. 5.9.2 Power Sequencing
        1. 5.9.2.1   Power Management and Supervisory Circuit Solutions
        2. Table 5-5 Reset (XRS) Timing Requirements
      3. 5.9.3 Clock Requirements and Characteristics
        1. Table 5-6 Input Clock Frequency
        2. Table 5-7 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-8 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.9.4 Peripherals
        1. 5.9.4.1 General-Purpose Input/Output (GPIO)
          1. 5.9.4.1.1 GPIO - Output Timing
            1. Table 5-10 General-Purpose Output Switching Characteristics
          2. 5.9.4.1.2 GPIO - Input Timing
            1. Table 5-11 General-Purpose Input Timing Requirements
          3. 5.9.4.1.3 Sampling Window Width for Input Signals
          4. 5.9.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-12 IDLE Mode Timing Requirements
            2. Table 5-13 IDLE Mode Switching Characteristics
            3. Table 5-14 STANDBY Mode Timing Requirements
            4. Table 5-15 STANDBY Mode Switching Characteristics
            5. Table 5-16 HALT Mode Timing Requirements
            6. Table 5-17 HALT Mode Switching Characteristics
        2. 5.9.4.2 Enhanced Control Peripherals
          1. 5.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-18 ePWM Timing Requirements
            2. Table 5-19 ePWM Switching Characteristics
          2. 5.9.4.2.2 Trip-Zone Input Timing
            1. Table 5-20 Trip-Zone input Timing Requirements
          3. 5.9.4.2.3 High-Resolution PWM Timing
            1. Table 5-21 High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz)
          4. 5.9.4.2.4 ADC Start-of-Conversion Timing
            1. Table 5-22 External ADC Start-of-Conversion Switching Characteristics
        3. 5.9.4.3 External Interrupt Timing
          1. Table 5-23 External Interrupt Timing Requirements
          2. Table 5-24 External Interrupt Switching Characteristics
        4. 5.9.4.4 I2C Electrical Specification and Timing
          1. Table 5-25 I2C Timing
        5. 5.9.4.5 Serial Peripheral Interface (SPI) Master Mode Timing
          1. Table 5-26 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 5-27 SPI Master Mode External Timing (Clock Phase = 1)
        6. 5.9.4.6 SPI Slave Mode Timing
          1. Table 5-28 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 5-29 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.9.5 JTAG Debug Probe Connection Without Signal Buffering for the DSP
      6. 5.9.6 Flash Timing
        1. Table 5-30 Flash Endurance for A Temperature Material
        2. Table 5-31 Flash Parameters at 100-MHz SYSCLKOUT
        3. Table 5-32 Flash/OTP Access Timing
        4. Table 5-33 Flash Data Retention Duration
    10. 5.10 On-Chip Analog-to-Digital Converter
      1. Table 5-35 ADC Electrical Characteristics (over recommended operating conditions)
      2. 5.10.1     ADC Power-Up Control Bit Timing
        1. Table 5-36 ADC Power-Up Delays
        2. Table 5-37 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 5.10.2     Definitions
      4. 5.10.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-38 Sequential Sampling Mode Timing
      5. 5.10.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-39 Simultaneous Sampling Mode Timing
      6. 5.10.5     Detailed Descriptions
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  M0, M1 SARAMs
      7. 6.1.7  L0, L1 SARAMs
      8. 6.1.8  Boot ROM
      9. 6.1.9  Security
      10. 6.1.10 Peripheral Interrupt Expansion (PIE) Block
      11. 6.1.11 External Interrupts (XINT1, XINT2, XNMI)
      12. 6.1.12 Oscillator and PLL
      13. 6.1.13 Watchdog
      14. 6.1.14 Peripheral Clocking
      15. 6.1.15 Low-Power Modes
      16. 6.1.16 Peripheral Frames 0, 1, 2 (PFn)
      17. 6.1.17 General-Purpose Input/Output (GPIO) Multiplexer
      18. 6.1.18 32-Bit CPU-Timers (0, 1, 2)
      19. 6.1.19 Control Peripherals
      20. 6.1.20 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1 32-Bit CPU-Timers 0/1/2
      2. 6.2.2 Enhanced PWM Modules (ePWM1–16)
      3. 6.2.3 Hi-Resolution PWM (HRPWM)
      4. 6.2.4 Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.4.1 ADC Connections if the ADC Is Not Used
        2. 6.2.4.2 ADC Registers
      5. 6.2.5 Serial Communications Interface (SCI) Module (SCI-A)
      6. 6.2.6 Serial Peripheral Interface (SPI) Module (SPI-A)
      7. 6.2.7 Inter-Integrated Circuit (I2C)
      8. 6.2.8 GPIO MUX
    3. 6.3 Memory Map
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

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発注情報

8.4 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the processor, related peripherals, and other technical collateral is listed below.

Errata

TMS320F28044 Digital Signal Processor Silicon Errata describes the advisories and usage notes for different versions of silicon.

CPU User's Guides

TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). It also describes emulation features available on these DSPs.

TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide describes the various interrupts and system control features of the 280x digital signal processors (DSPs).

Peripheral Guides

C2000 Real-Time Control Peripherals Reference Guide describes the peripheral reference guides of the 28x digital signal processors (DSPs).

TMS320x280x, 2801x, 2804x DSP Analog-to-Digital Converter (ADC) Reference Guide describes how to configure and use the on-chip ADC module, which is a 12-bit pipelined ADC.

TMS320x280x, 2801x, 2804x Enhanced Pulse Width Modulator (ePWM) Module Reference Guide describes the main areas of the enhanced pulse width modulator that include digital motor control, switch mode power supply control, UPS (uninterruptible power supplies), and other forms of power conversion.

TMS320x280x, 2801x, 2804x Enhanced Quadrature Encoder Pulse (eQEP) Module Reference Guide describes the eQEP module, which is used for interfacing with a linear or rotary incremental encoder to get position, direction, and speed information from a rotating machine in high performance motion and position control systems. It includes the module description and registers.

TMS320x280x, 2801x, 2804x Enhanced Capture (eCAP) Module Reference Guide describes the enhanced capture module. It includes the module description and registers.

TMS320x280x, 2801x, 2804x High Resolution Pulse Width Modulator (HRPWM) Reference Guide describes the operation of the high-resolution extension to the pulse width modulator (HRPWM).

TMS320x281x Enhanced Controller Area Network (eCAN) Reference Guide describes the eCAN that uses established protocol to communicate serially with other controllers in electrically noisy environments.

TMS320x281x Serial Communications Interface (SCI) Reference Guide describes the SCI, which is a two-wire asynchronous serial port, commonly known as a UART. The SCI modules support digital communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero (NRZ) format.

TMS320x281x Serial Peripheral Interface Reference Guide describes the SPI, a high-speed synchronous serial input/output (I/O) port, that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmed bit-transfer rate.

TMS320x280x, 2801x, 2804x Serial Communications Interface (SCI) Reference Guide describes the features and operation of the serial communication interface (SCI) module that is available on the TMS320x280x, 2801x, 2804x devices.

TMS320x280x, 2801x, 2804x Serial Peripheral Interface Reference Guide describes how the serial peripheral interface works.

TMS320x280x, 2801x, 2804x Inter-Integrated Circuit (I2C) Module Reference Guide describes the features and operation of the inter-integrated circuit (I2C) module.

TMS320x280x, 2801x, 2804x Boot ROM Reference Guide describes the purpose and features of the bootloader (factory-programmed boot-loading software). It also describes other contents of the device on-chip boot ROM and identifies where all of the information is located within that memory.

Tools Guides

TMS320C28x Assembly Language Tools v20.2.0.LTS User's Guide describes the assembly language tools (assembler and other tools used to develop assembly language code), assembler directives, macros, common object file format, and symbolic debugging directives for the TMS320C28x device.

TMS320C28x Optimizing C/C++ Compiler v20.2.0.LTS User's Guide describes the TMS320C28x C/C++ compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly language source code for the TMS320C28x device.

TMS320C28x DSP/BIOS 5.x Application Programming Interface (API) Reference Guide describes development using DSP/BIOS.

Application Reports

TMS320x281x to TMS320x2833x or 2823x Migration Overview describes how to migrate from the 281x device design to 2833x or 2823x designs.

TMS320x280x to TMS320x2833x or 2823x Migration Overview describes how to migrate from a 280x device design to 2833x or 2823x designs.

TMS320C28x FPU Primer provides an overview of the floating-point unit (FPU) in the C2000™ premium performance MCUs.

Running an Application from Internal Flash Memory on the TMS320F28xxx DSP covers the requirements needed to properly configure application software for execution from on-chip flash memory. Requirements for both DSP/BIOS and non-DSP/BIOS projects are presented. Example code projects are included.

Programming TMS320x28xx and TMS320x28xxx Peripherals in C/C++ explores a hardware abstraction layer implementation to make C/C++ coding easier on 28x DSPs. This method is compared to traditional #define macros and topics of code efficiency and special case registers are also addressed.

Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x Digital Signal Controller presents a method for using the on-chip pulse width modulated (PWM) signal generators on the TMS320F280x family of digital signal controllers as a digital-to-analog converter (DAC).

TMS320F280x Digital Signal Controller USB Connectivity using the TUSB3410 USB-to-UART Bridge Chip presents hardware connections as well as software preparation and operation of the development system using a simple communication echo program.

Using the Enhanced Quadrature Encoder Pulse (eQEP) Module in TMS320x280x, 28xxx as a Dedicated Capture provides a guide for the use of the eQEP module as a dedicated capture unit and is applicable to the TMS320x280x, 28xxx family of processors.

Using the ePWM Module for 0% - 100% Duty Cycle Control provides a guide for the use of the ePWM module to provide 0% to 100% duty cycle control and is applicable to the TMS320x280x family of processors.

TMS320280x and TMS3202801x ADC Calibration describes a method for improving the absolute accuracy of the 12-bit ADC found on the TMS320x280x and TMS320F2801x devices. Inherent gain and offset errors affect the absolute accuracy of the ADC. The methods described in this report can improve the absolute accuracy of the ADC to levels better than 0.5%. This application report has an option to download an example program that executes from RAM on the F2808 EzDSP.

Online Stack Overflow Detection on the TMS320C28x DSP presents the methodology for online stack overflow detection on the TMS320C28x DSP. C-source code is provided that contains functions for implementing the overflow detection on both DSP/BIOS and non-DSP/BIOS applications.

TMS320x281x to TMS320x280x Migration Overview describes differences between the Texas Instruments TMS320x281x and the TMS320x280x/2801x/2804x DSPs to assist in application migration.

Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor devices for shipment to end users.

An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/output structures and future trends.

Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.

Semiconductor and IC Package Thermal Metrics describes traditional and new thermal metrics and puts their application in perspective with respect to system-level junction temperature estimation.

Calculating FIT for a Mission Profile explains how use TI’s reliability de-rating tools to calculate a component level FIT under power on conditions for a system mission profile.

Serial Flash Programming of C2000™ Microcontrollers discusses using a flash kernel and ROM loaders for serial programming a device.