SLVSBX9A September   2014  – September 2014 TPS61291

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bypass / Boost Mode Operation EN/BYP
      2. 7.3.2 Output Voltage Selection VSEL
      3. 7.3.3 Feedback Divider Disconnect
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Overtemperature Protection
      6. 7.3.6 Overvoltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost Mode Operation
      2. 7.4.2 Bypass Mode Operation
      3. 7.4.3 Controlled Transition into Bypass Mode
      4. 7.4.4 Operation at Output Overload
      5. 7.4.5 Startup
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Layout

10.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well as EMI problems. It is critical to provide a low inductance, low impedance ground path. Therefore, use wide and short traces for the main current paths. In a boost converter, the ripple current on the output is larger than the ripple current on the input. The output capacitor needs to be placed as close as possible between the VOUT and the GND pins. The input capacitor should be placed as close as possible to the VIN and GND pins. Place the inductor close by the IC and connect it with short and thick traces to the IC. Avoid current loops to minimize radiated noise and stray fields. The exposed thermal pad of the package and the GND pin must be connected. See Figure 28 for the recommended PCB layout.

10.2 Layout Example

TPS61291_pcb_d_s.gifFigure 28. Recommended PCB Layout