SBVS169D December   2011  – April 2015 TPS7A33

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Enable Pin Operation
      3. 7.3.3 Programmable Soft-Start
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Adjustable Operation
      2. 8.1.2  Capacitor Recommendations
      3. 8.1.3  Input and Output Capacitor Requirements
      4. 8.1.4  Noise Reduction and Feed-Forward Capacitor Requirements
      5. 8.1.5  Post DC-DC Converter Filtering
      6. 8.1.6  Audio Applications
      7. 8.1.7  Maximum AC Performance
      8. 8.1.8  Power-Supply Rejection
      9. 8.1.9  Output Noise
      10. 8.1.10 Transient Response
      11. 8.1.11 Power for Precision Analog
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don’ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Thermal Performance and Heat Sink Selection
    4. 10.4 Package Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from C Revision (February 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Corrected title of data sheet to show accurate maximum output current; changed "–1 A" to "1-A" Go
  • Changed front-page figures and deleted note stating that RGW package was product previewGo
  • Changed Pin Configuration and Functions section; updated table format and deleted footnote about RGW product-preview statusGo
  • Deleted footnote from Pin Functions table indicating RGW product-preview statusGo
  • Deleted footnote (2) from Absolute Maximum Ratings tableGo
  • Deleted note from Thermal Information table stating that RGW package was product preview Go
  • Corrected condition values for Figure 23Go
  • Corrected condition values for Figure 24Go
  • Corrected condition values and trace indicators for Figure 25Go
  • Corrected condition values and trace indicators for Figure 26Go
  • Changed CSS value from 1 µF to 10 nF in Figure 27Go
  • Deleted Parametric Measurement Information section Go
  • Revised Functional Block DiagramGo
  • Changed first paragraph of Adjustable Operation section stating the device output voltage rangeGo
  • Changed Equation 2 for clarity Go
  • Changed last sentence of Capacitor Recommendations section Go
  • Changed noise reduction capacitor value from 1 µF to 10 nF in first paragraph of Power-Supply Rejection section.Go
  • Revised last paragraph of Power-Supply Rejection sectionGo
  • Changed noise reduction capacitor value from 1 µF to 10 nF in second paragraph of Output Noise section.Go
  • Added footnote (1) to Figure 32Go
  • Changed title for Figure 41Go
  • Changed title for Figure 42Go
  • Changed Power Dissipation section title to Layout Guidelines for Thermal Performance and Heat Sink SelectionGo
  • Revised wording in Layout Guidelines for Thermal Performance section for clarification Go

Changes from B Revision (March 2012) to C Revision

  • Changed product status from Mixed Status to Production DataGo
  • Added last paragraph in Description sectionGo
  • Changed typical application block diagramGo
  • Updated Figure 31Go

Changes from A Revision (December 2011) to B Revision

  • Changed product status from Production Data to Mixed StatusGo
  • Added RGW pinout drawingGo
  • Added RGW pinout drawing to Pin Configuration and Functions sectionGo
  • Added RGW and footnote 1 to Pin Functions tableGo
  • Added RGW column to Thermal Information tableGo

Changes from * Revision (December 2011) to A Revision

  • Changed product status from Product Preview to Production DataGo