The ISOTMP35 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000 V RMS withstand voltage, with an analog temperature sensor featuring a 10 mV/°C slope from –40°C to +150°C. This integration enables the sensor to be co-located with high voltage heat source (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3-V to 5.5-V supply, the ISOTMP35 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
The ISOTMP35 class-AB output driver provides a strong 500-µA maximum output to drive capacitive loads up to 1000 pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.
The ISOTMP35 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000 V RMS withstand voltage, with an analog temperature sensor featuring a 10 mV/°C slope from –40°C to +150°C. This integration enables the sensor to be co-located with high voltage heat source (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3-V to 5.5-V supply, the ISOTMP35 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
The ISOTMP35 class-AB output driver provides a strong 500-µA maximum output to drive capacitive loads up to 1000 pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.