The AUP family is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G02 performs the Boolean function Y = A + B or Y = A ⋅ B in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoStar is a trademark of Texas Instruments.
|Part number||オーダー・オプション||Technology Family||VCC (Min) (V)||VCC (Max) (V)||Channels (#)||Inputs per channel||IOL (Max) (mA)||IOH (Max) (mA)||Input type||Output type||Features||Data rate (Max) (Mbps)||Rating||Operating temperature range (C)||Package size: mm2:W x L (PKG)||Package Group|
Partial Power Down (Ioff)
Over-Voltage Tolerant Inputs
Very High Speed (tpd 5-10ns)
|100||Catalog||-40 to 85||
See datasheet (DSBGA)
8UQFN: 2 mm2: 1.5 x 1.5 (UQFN | 8)
8VSSOP: 6 mm2: 3.1 x 2 (VSSOP | 8)
8X2SON: 1 mm2: 1 x 1.4 (X2SON | 8)
DSBGA | 8
UQFN | 8
VSSOP | 8
X2SON | 8