Configuration2:1 SPDTNumber of channels (#)4Power supply voltage - single (V)2.5, 3.3Ron (Typ) (Ohms)5ON-state leakage current (Max) (µA)1Bandwidth (MHz)200Operating temperature range (C)-40 to 85FeaturesPowered-off protection, Supports JTAG signals, Supports SPI signalsInput/output continuous current (Max) (mA)128RatingCatalogopen-in-newその他の アナログ・スイッチ/マルチプレクサ
J6Entry, RSP and TDA2E-17 CPU Board EVM is an evaluation platform designed to speed up development efforts and reduce time to market for Infotainment reconfigurable Digital Cluster or Integrated Digital Cockpit and ADAS applications. The CPU board integrates key peripherals such as parallel (...)
The J6Entry/RSP EVM is an evaluation platform designed to speed up development efforts and reduce time to market for applications such as Infotainment, reconfigurable Digital Cluster or Integrated Digital Cockpit.
The main CPU board integrates these key peripherals such as Ethernet or HDMI, while the (...)
The Smart Amplifier Speaker Characterization Board, when used in conjunction with a supported TI Smart Amplifier and PurePath Console software, provides users the ability to measure speaker excursion, temperature and other parameters for (...)
The DM38x Camera Starter Kit (CSK) enables developers to begin designing wireless or wired connected digital video applications, such as security cameras, car DVRs, endoscopes, action-wearable cameras, drones, video doorbells, baby monitors, and other connected video products.
The DM38x (...)
TMDSCSK388: 60-mm x 44-mm DM388 processor board
TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
The TMS320DM36x Digital Video Evaluation Module (DVEVM) enables developers to start immediate evaluation of TI’s Digital Media (DMx) processors and begin building digital video applications such as IP security cameras, action cameras, drones, wearables, digital signage, video doorbells, and (...)
TMS320DM368 Digital Media processor-based development board
Parallel Camera Input compatible with Leopard Imaging LI-5M02 camera board
Video capture of NTSC or PAL signals via component for HD and composite/S-Video for SD
NTSC or PAL output via component for HD and composite/S-Video for SD
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel
TIDA-01226 — This reference design, featuring the DLP Pico™ 0.47-inch TRP Full-HD 1080p display chipset and implemented in the DLP LightCrafter Display 4710 G2 evaluation module (EVM), enables use of full HD resolution for projection display applications such as accessory projectors, screenless displays (...)
TIDA-01023 — High-speed multi-channel applications require low noise and scalable clocking solutions capable of precise channel-to-channel skew adjustment to achieve optimal system SNR, SFDR, and ENOB. This reference design supports high channel count JESD204B synchronized clocks using one master and multiple (...)
TIDA-01024 — High-speed multi-channel applications require low noise and scalable clocking solutions capable of precise channel-to-channel skew adjustment to achieve optimal system SNR, SFDR, and ENOB. This reference design supports scaling up JESD204B synchronized clocks in daisy chain configuration. This (...)