SN74GTLP817

アクティブ

GTLP から LVTTL への変換、1 入力 6 出力、ファンアウト・ドライバ

製品詳細

Technology family GTLP Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
Technology family GTLP Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (PW) 24 49.92 mm² 7.8 x 6.4
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • GTLP-to-LVTTL 1-to-6 Fanout Driver
  • LVTTL-to-GTLP 1-to-2 Fanout Driver
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • Reduced-Drive LVTTL Outputs (\x9612 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and TI are trademarks of Texas Instruments.

  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • GTLP-to-LVTTL 1-to-6 Fanout Driver
  • LVTTL-to-GTLP 1-to-2 Fanout Driver
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • Reduced-Drive LVTTL Outputs (\x9612 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and TI are trademarks of Texas Instruments.

The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11 .

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC .

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11 .

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC .

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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技術資料

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート GTLP-to-LVTTL 1-to-6 Fanout Driver データシート (Rev. E) 2001年 8月 14日
セレクション・ガイド Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
セレクション・ガイド Logic Guide (Rev. AB) 2017年 6月 12日
アプリケーション・ノート Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
セレクション・ガイド ロジック・ガイド (Rev. AA 翻訳版) 最新英語版 (Rev.AB) 2014年 11月 6日
ユーザー・ガイド LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
アプリケーション・ノート Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
アプリケーション・ノート TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
アプリケーション・ノート Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
アプリケーション・ノート Logic in Live-Insertion Applications With a Focus on GTLP 2002年 1月 14日
ユーザー・ガイド GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 2001年 9月 15日
アプリケーション・ノート Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP) 2001年 4月 5日
セレクション・ガイド Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
アプリケーション概要 Texas Instruments GTLP Frequently Asked Questions 2001年 1月 1日
アプリケーション・ノート Fast GTLP Backplanes With the GTLPH1655 (Rev. A) 2000年 9月 19日
その他の技術資料 High Level Brochure of Gunning Transceiver Logic Plus 2000年 1月 14日

設計と開発

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評価ボード

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ユーザー ガイド: PDF | HTML
シミュレーション・モデル

HSPICE Model of SN74GTLP817

SCEJ119.ZIP (37 KB) - HSpice Model
シミュレーション・モデル

SN74GTLP817 IBIS Model

SCEM187.ZIP (25 KB) - IBIS Model
パッケージ ピン数 ダウンロード
TSSOP (PW) 24 オプションの表示

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 材質成分
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報:
  • ファブの拠点
  • 組み立てを実施した拠点

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