Configuration8:1Number of channels (#)1Power supply voltage - single (V)1.8, 2.5, 3.3, 5Ron (Typ) (Ohms)22ON-state leakage current (Max) (µA)1Bandwidth (MHz)35Operating temperature range (C)-40 to 85Input/output continuous current (Max) (mA)25RatingCatalogCON (Typ) (pF)5.7open-in-newその他の アナログ・スイッチ/マルチプレクサ
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel