Configuration2:1 SPDTNumber of channels (#)3Power supply voltage - single (V)1.8, 2.5, 3.3, 5Ron (Typ) (Ohms)23ON-state leakage current (Max) (µA)1Bandwidth (MHz)50Operating temperature range (C)-40 to 85Input/output continuous current (Max) (mA)25RatingCatalogCON (Typ) (pF)5.6open-in-newその他の アナログ・スイッチ/マルチプレクサ
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel
PMP15043 — This reference design circuit introduces a highly accurate, bi-directional current power solution used in battery test systems (BTS). The maximum current capability is 6A with lower than 0.05% full scale accuracy. Controlling through a logic pin, the circuit can be used to charge or discharge a (...)