製品の詳細

DSP 1 C55x DSP MHz (Max) 160, 200 CPU 16-bit Operating system DSP/BIOS, VLX Rating Catalog Operating temperature range (C) -40 to 85, 0 to 85
DSP 1 C55x DSP MHz (Max) 160, 200 CPU 16-bit Operating system DSP/BIOS, VLX Rating Catalog Operating temperature range (C) -40 to 85, 0 to 85
NFBGA (GBC) 240 225 mm² 15 x 15 NFBGA (ZAV) 240 225 mm² 15 x 15
  • High-Performance, Low-Power, Fixed-Point TMS320C55x™; Digital Signal Processor (DSP)
    • 6.25-/5-ns Instruction Cycle Time
    • 160-/200-MHz Clock Rate
    • One/Two Instructions Executed per Cycle
    • Dual Multipliers (Up to 400 Million Multiply-Accumulates Per Second (MMACS))
    • Two Arithmetic/Logic Units
    • One Internal Program Bus
    • Three Internal Data/Operand Read Buses
    • Two Internal Data/Operand Write Buses
  • Instruction Cache (24K Bytes)
  • 160K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 4K × 16-Bit Dual-Access RAM (DARAM) (64K Bytes)
    • 32 Blocks of 4K × 16-Bit Single-Access RAM (SARAM)(256K Bytes)
  • 16K × 16-Bit On-Chip ROM (32K Bytes)
  • 8M × 16-Bit Maximum Addressable External Memory Space
  • 32-Bit External Memory Interface (EMIF) With Glueless Interface to:
    • Asynchronous Static RAM (SRAM)
    • Asynchronous EPROM
    • Synchronous DRAM (SDRAM)
    • Synchronous Burst SRAM (SBSRAM)
  • Programmable Low-Power Control of Six Device Functional Domains
  • On-Chip Peripherals
    • Two 20-Bit Timers
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 16-Bit Parallel Enhanced Host-Port Interface (EHPI)
    • Programmable Digital Phase-Locked Loop (DPLL) Clock Generator
    • Eight General-Purpose I/O (GPIO) Pins and Dedicated General-Purpose Output (XF)
  • On-Chip Scan-Based Emulation Logic
  • IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 240-Terminal MicroStar BGA™; (Ball Grid Array) (GGW Suffix)
  • 240-Terminal MicroStar BGA™; (Ball Grid Array) (ZGW Suffix) [Lead-Free]
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

TMS320C55x and MicroStar BGA are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
C55x, eXpressDSP, Code Composer Studio, DSP/BIOS, TMS320, RTDX, and XDS510 are trademarks of Texas Instruments.

  • High-Performance, Low-Power, Fixed-Point TMS320C55x™; Digital Signal Processor (DSP)
    • 6.25-/5-ns Instruction Cycle Time
    • 160-/200-MHz Clock Rate
    • One/Two Instructions Executed per Cycle
    • Dual Multipliers (Up to 400 Million Multiply-Accumulates Per Second (MMACS))
    • Two Arithmetic/Logic Units
    • One Internal Program Bus
    • Three Internal Data/Operand Read Buses
    • Two Internal Data/Operand Write Buses
  • Instruction Cache (24K Bytes)
  • 160K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 4K × 16-Bit Dual-Access RAM (DARAM) (64K Bytes)
    • 32 Blocks of 4K × 16-Bit Single-Access RAM (SARAM)(256K Bytes)
  • 16K × 16-Bit On-Chip ROM (32K Bytes)
  • 8M × 16-Bit Maximum Addressable External Memory Space
  • 32-Bit External Memory Interface (EMIF) With Glueless Interface to:
    • Asynchronous Static RAM (SRAM)
    • Asynchronous EPROM
    • Synchronous DRAM (SDRAM)
    • Synchronous Burst SRAM (SBSRAM)
  • Programmable Low-Power Control of Six Device Functional Domains
  • On-Chip Peripherals
    • Two 20-Bit Timers
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 16-Bit Parallel Enhanced Host-Port Interface (EHPI)
    • Programmable Digital Phase-Locked Loop (DPLL) Clock Generator
    • Eight General-Purpose I/O (GPIO) Pins and Dedicated General-Purpose Output (XF)
  • On-Chip Scan-Based Emulation Logic
  • IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 240-Terminal MicroStar BGA™; (Ball Grid Array) (GGW Suffix)
  • 240-Terminal MicroStar BGA™; (Ball Grid Array) (ZGW Suffix) [Lead-Free]
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

TMS320C55x and MicroStar BGA are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
C55x, eXpressDSP, Code Composer Studio, DSP/BIOS, TMS320, RTDX, and XDS510 are trademarks of Texas Instruments.

The TMS320VC5510/5510A (5510/5510A) fixed-point digital signal processors (DSPs) are based on the TMS320C55x DSP generation CPU processor core. The C55x™;DSP architecture achieves high performance and low power through increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal bus structure composed of one program bus, three data read buses, two data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform up to two data transfers per cycle independent of the CPU activity.

The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the address unit (AU) and data unit (DU) of the C55x CPU.

The C55x™; DSP generation supports a variable byte width instruction set for improved code density. The instruction unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the program unit (PU). The program unit decodes the instructions, directs tasks to AU and DU resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions. The 5510/5510A also includes a 24K-byte instruction cache to minimize external memory accesses, improving data throughput and conserving system power.

The 5510/5510A peripheral set includes an external memory interface (EMIF) that provides glueless access to asynchronous memories like EPROM and SRAM, as well as to high-speed, high-density memories such as synchronous DRAM and synchronous burst SRAM. Three full-duplex multichannel buffered serial ports (McBSPs) provide glueless interface to a variety of industry-standard serial devices, and multichannel communication with up to 128 separately enabled channels. The enhanced host-port interface (EHPI) is a 16-bit parallel interface used to provide host processor access to internal memory on the 5510/5510A. The EHPI can be configured in either multiplexed or non-multiplexed mode to provide glueless interface to a wider variety of host processors. The DMA controller provides data movement for six independent channel contexts without CPU intervention, providing DMA throughput of up to two 16-bit words per cycle. Two general-purpose timers, eight general-purpose I/O (GPIO) pins, and digital phase-locked loop (DPLL) clock generation are also included.

The 5510/5510A is supported by the industry’s leading eXpressDSP™; software environment including the Code Composer Studio™; integrated development environment, DSP/BIOS™; software kernel foundation, the TMS320™; DSP Algorithm Standard, and the industry’s largest third-party network. Code Composer Studio features code generation tools including a C-Compiler, Visual Linker, simulator, Real-Time Data Exchange (RTDX™;), XDS510™; emulation device drivers, and Chip Support Libraries (CSL). DSP/BIOS is a scalable real-time software foundation available for no cost to users of Texas Instruments’ DSP products providing a pre-emptive task scheduler and real-time analysis capabilities with very low memory and megahertz overhead. The TMS320 DSP Algorithm Standard is a specification of coding conventions allowing fast integration of algorithms from different teams, sites, or third parties into the application framework. Texas Instruments’ extensive DSP third-party network of over 400 providers brings focused competencies and complete solutions to customers.

Texas Instruments (TI) has also developed foundation software available for the 5510/5510A. The C55x DSP Library (DSPLIB) features over 50 C-callable software kernels (FIR/IIR filters, Fast Fourier Transforms (FFTs), and various computational functions). The DSP Image/Video Processing Library (IMGLIB) contains over 20 software kernels highly optimized for C55x DSPs and is compiled with the latest revision of the C55x DSP code generation tools. These imaging functions support a wide range of applications that include compression, video processing, machine vision, and medical imaging.

The TMS320C55x DSP core was created with an open architecture that allows the addition of application-specific hardware to boost performance on specific algorithms. The hardware extensions on the 5510/5510A strike the perfect balance of fixed function performance with programmable flexibility, while achieving low-power consumption, and cost that traditionally has been difficult to find in the video-processor market. The extensions allow the 5510/5510A to deliver exceptional video codec performance with more than half its bandwidth available for performing additional functions such as color space conversion, user-interface operations, security, TCP/IP, voice recognition, and text-to-speech conversion. As a result, a single 5510/5510A DSP can power most portable digital video applications with processing headroom to spare. For more information, see the TMS320C55x Hardware Extensions for Image/Video Applications Programmer’s Reference (literature number SPRU098). For more information on using the the DSP Image Processing Library, see the TMS320C55x Image/Video Processing Library Programmer’s Reference (literature number SPRU037).

The TMS320VC5510/5510A (5510/5510A) fixed-point digital signal processors (DSPs) are based on the TMS320C55x DSP generation CPU processor core. The C55x™;DSP architecture achieves high performance and low power through increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal bus structure composed of one program bus, three data read buses, two data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform up to two data transfers per cycle independent of the CPU activity.

The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the address unit (AU) and data unit (DU) of the C55x CPU.

The C55x™; DSP generation supports a variable byte width instruction set for improved code density. The instruction unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the program unit (PU). The program unit decodes the instructions, directs tasks to AU and DU resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions. The 5510/5510A also includes a 24K-byte instruction cache to minimize external memory accesses, improving data throughput and conserving system power.

The 5510/5510A peripheral set includes an external memory interface (EMIF) that provides glueless access to asynchronous memories like EPROM and SRAM, as well as to high-speed, high-density memories such as synchronous DRAM and synchronous burst SRAM. Three full-duplex multichannel buffered serial ports (McBSPs) provide glueless interface to a variety of industry-standard serial devices, and multichannel communication with up to 128 separately enabled channels. The enhanced host-port interface (EHPI) is a 16-bit parallel interface used to provide host processor access to internal memory on the 5510/5510A. The EHPI can be configured in either multiplexed or non-multiplexed mode to provide glueless interface to a wider variety of host processors. The DMA controller provides data movement for six independent channel contexts without CPU intervention, providing DMA throughput of up to two 16-bit words per cycle. Two general-purpose timers, eight general-purpose I/O (GPIO) pins, and digital phase-locked loop (DPLL) clock generation are also included.

The 5510/5510A is supported by the industry’s leading eXpressDSP™; software environment including the Code Composer Studio™; integrated development environment, DSP/BIOS™; software kernel foundation, the TMS320™; DSP Algorithm Standard, and the industry’s largest third-party network. Code Composer Studio features code generation tools including a C-Compiler, Visual Linker, simulator, Real-Time Data Exchange (RTDX™;), XDS510™; emulation device drivers, and Chip Support Libraries (CSL). DSP/BIOS is a scalable real-time software foundation available for no cost to users of Texas Instruments’ DSP products providing a pre-emptive task scheduler and real-time analysis capabilities with very low memory and megahertz overhead. The TMS320 DSP Algorithm Standard is a specification of coding conventions allowing fast integration of algorithms from different teams, sites, or third parties into the application framework. Texas Instruments’ extensive DSP third-party network of over 400 providers brings focused competencies and complete solutions to customers.

Texas Instruments (TI) has also developed foundation software available for the 5510/5510A. The C55x DSP Library (DSPLIB) features over 50 C-callable software kernels (FIR/IIR filters, Fast Fourier Transforms (FFTs), and various computational functions). The DSP Image/Video Processing Library (IMGLIB) contains over 20 software kernels highly optimized for C55x DSPs and is compiled with the latest revision of the C55x DSP code generation tools. These imaging functions support a wide range of applications that include compression, video processing, machine vision, and medical imaging.

The TMS320C55x DSP core was created with an open architecture that allows the addition of application-specific hardware to boost performance on specific algorithms. The hardware extensions on the 5510/5510A strike the perfect balance of fixed function performance with programmable flexibility, while achieving low-power consumption, and cost that traditionally has been difficult to find in the video-processor market. The extensions allow the 5510/5510A to deliver exceptional video codec performance with more than half its bandwidth available for performing additional functions such as color space conversion, user-interface operations, security, TCP/IP, voice recognition, and text-to-speech conversion. As a result, a single 5510/5510A DSP can power most portable digital video applications with processing headroom to spare. For more information, see the TMS320C55x Hardware Extensions for Image/Video Applications Programmer’s Reference (literature number SPRU098). For more information on using the the DSP Image Processing Library, see the TMS320C55x Image/Video Processing Library Programmer’s Reference (literature number SPRU037).

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技術資料

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26 資料すべて表示
種類 タイトル 英語版のダウンロード 日付
* データシート TMS320VC5510/5510A Fixed-Point Digital Signal Processors データシート (Rev. O) 2007年 9月 24日
* エラッタ TMS320VC5510A MicroStar BGA Discontinued and Redesigned Manual Update Sheet 2020年 5月 22日
* エラッタ TMS320VC5510/5510A Digital Signal Processors Silicon Errata (Rev. O) 2008年 4月 9日
技術記事 Bringing the next evolution of machine learning to the edge 2018年 11月 27日
技術記事 How quality assurance on the Processor SDK can improve software scalability 2018年 8月 22日
技術記事 Clove: Low-Power video solutions based on Sitara™ AM57x processors 2016年 7月 21日
技術記事 TI's new DSP Benchmark Site 2016年 2月 8日
ユーザー・ガイド TMS320C55x DSP Peripherals Overview Reference Guide (Rev. K) 2011年 12月 15日
アプリケーション・ノート ADS1255 および TMS320VC5510A DSP を使用した地震センサのデモンストレーション (Rev. A 翻訳版) 英語版をダウンロード (Rev.A) 2010年 1月 7日
ユーザー・ガイド TMS320VC5503/5507/5509/5510 Direct Memory Access(DMA) Controller Reference Guide (Rev. E) 2007年 1月 9日
ユーザー・ガイド TMS320VC5501/5502/5503/5507/5509/5510 DSPマルチチャネル・バッファド・シリアル・ポート(McBSP) (Rev. E 翻訳版) 英語版をダウンロード (Rev.E) 2006年 11月 27日
ユーザー・ガイド TMS320C55x DSP CPU リファレンス・ガイド (Rev. F 翻訳版) 英語版をダウンロード (Rev.F) 2006年 11月 6日
ユーザー・ガイド TMS320VC5503/5507/5509/5510 DMA ダイレクト・メモリ・アクセス (DMA)コントローラ リファレンス・ガイド (Rev. D 翻訳版) 最新の英語版をダウンロード (Rev.E) 2006年 11月 6日
ユーザー・ガイド TMS320VC5503/5507/5509/5510 DSP Timers Reference Guide (Rev. C) 2006年 4月 11日
アプリケーション・ノート TMS320VC5510/5510A Hardware Designer's Resource Guide (Rev. A) 2005年 4月 20日
ユーザー・ガイド TMS320C55x DSP CPU Programmer's Reference Supplement (Rev. G) 2005年 2月 24日
アプリケーション・ノート Using the TMS320VC5510 Bootloader (Rev. C) 2004年 10月 19日
アプリケーション・ノート Using the Power Scaling Library (Rev. A) 2004年 9月 30日
ユーザー・ガイド TMS320VC5510 DSP Host Port Interface (HPI) Reference Guide (Rev. B) 2004年 8月 23日
ユーザー・ガイド TMS320VC5510 DSP Instruction Cache Reference Guide (Rev. D) 2004年 6月 16日
アプリケーション・ノート TMS320VC5510 HPI Throughput and Optimization 2004年 5月 27日
アプリケーション・ノート TMS320VC5510 Power Consumption Summary 2003年 11月 12日
ユーザー・ガイド TMS320VC5510 DSP External Memory Interface (EMIF) Reference Guide 2003年 10月 8日
アプリケーション・ノート Interfacing TMS320VC5510 to SBSRAM (Rev. A) 2003年 6月 16日
アプリケーション・ノート Migrating from TMS320VC5510 to TMS320VC5502 2003年 2月 28日
ユーザー・ガイド TMS320C55x DSP Functional Overview 1999年 2月 24日

設計と開発

追加の事項や他のリソースを参照するには、以下のタイトルをクリックすると、詳細ページを表示できます。

デバッグ・プローブ

TMDSEMU200-U — Spectrum Digital XDS200 USB エミュレータ

Spectrum Digital XDS200 は、TI のプロセッサを対象とする最新の XDS200 デバッグ・プローブ(エミュレータ)ファミリの最初のモデルです。XDS200 ファミリは、超低コストの XDS100 と高性能の XDS560v2 の間で、低コストと高性能の最適バランスを実現します。また、すべての XDS デバッグ・プローブは、ETB(Embedded Trace Buffer、組込みトレース・バッファ)を搭載したすべての ARM と DSP プロセッサに対し、コア・トレースとシステム・トレースをサポートしています。

Spectrum Digital XDS200 は、TI (...)

在庫あり
制限: 3
デバッグ・プローブ

TMDSEMU560V2STM-U — Blackhawk XDS560v2 システム・トレース USB エミュレータ

The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

在庫あり
制限: 1
デバッグ・プローブ

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 システム・トレース USB およびイーサネット

The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

在庫あり
制限: 1
ドライバまたはライブラリ

SPRC100 — TMS320C55x DSP ライブラリ

The DSP Library (DSPLIB) is a collection of high-level optimized DSP function modules for the C55x DSP platform. This source-code library includes C-callable functions (ANSI-C language compatible) for general signal processing math and vector functions that have been ported to C55x DSPs. The (...)
ドライバまたはライブラリ

TELECOMLIB — テレコムおよびメディア向けライブラリ - FAXLIB、VoLIB および AEC/AER、TMS320C64x+ および TMS320C55x プロセッサ用

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
ソフトウェア・コーデック

C55XCODECS — コーデック - C55x デバイス向けに最適化

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio and speech applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)
シミュレーション・モデル

VC5510 GGW BSDL Model (Rev. A)

SPRM085A.ZIP (6 KB) - BSDL Model
シミュレーション・モデル

VC5510 GGW IBIS Model (Rev. A)

SPRM165A.ZIP (67 KB) - IBIS Model
設計ツール

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
パッケージ ピン数 ダウンロード
NFBGA (GBC) 240 オプションの表示
NFBGA (ZAV) 240 オプションの表示

購入と品質

含まれる情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL rating/ リフローピーク温度
  • MTBF/FIT の推定値
  • 原材料組成
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果

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