ARM Cortex-R4F フラッシュ・マイクロコントローラ

TMS570LS20216 は新規設計での使用を推奨しません
従来の設計をサポートできるようにこの製品は引き続き生産中ですが、TI はこの製品を新規の設計には推奨しません。以下の代替品のいずれかをご検討ください。
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TMS570LS3137 アクティブ Arm Cortex-R4F 採用、EMAC と FlexRay 搭載、16/32 ビット RISC 型フラッシュ・マイコン (MCU) This product is the latest Hercules family of high-performance, automotive-grade MCUs for functional safety systems.

製品詳細

Frequency (MHz) 140, 160 Flash memory (kByte) 2048 RAM (kByte) 160 ADC type 2 x 12-bit (20ch), 2 x 12-bit (24ch) Number of GPIOs 68, 115 Features Hercules high-performance microcontroller TI functional safety category Functional Safety-Compliant Operating temperature range (°C) -40 to 125 CAN (#) 2, 3
Frequency (MHz) 140, 160 Flash memory (kByte) 2048 RAM (kByte) 160 ADC type 2 x 12-bit (20ch), 2 x 12-bit (24ch) Number of GPIOs 68, 115 Features Hercules high-performance microcontroller TI functional safety category Functional Safety-Compliant Operating temperature range (°C) -40 to 125 CAN (#) 2, 3
LQFP (PGE) 144 484 mm² 22 x 22 NFBGA (ZWT) 337 256 mm² 16 x 16
  • High-Performance Automotive Grade Microcontroller for Safety Critical Applications
    • Dual CPUs running in Lockstep
    • ECC on Flash and SRAM
    • CPU and Memory BIST (Built-In Self Test)
    • Error Signaling Module (ESM) w/ Error Pin
  • ARM® Cortex™-R4F 32-Bit RISC CPU
    • Efficient 1.6 DMIPS/MHz with 8-stage pipeline
    • Floating Point Unit with Single/Double Precision
    • Memory Protection Unit (MPU)
    • Open Architecture With Third-Party Support
  • Operating Features
    • Up to 160-MHz System Clock
    • Core Supply Voltage (VCC): 1.5 V
    • I/O Supply Voltage (VCCIO): 3.3 V
  • Integrated Memory
    • 1M-Byte or 2M-Byte Flash with ECC
    • 128K-Byte or 160K-Byte RAM with ECC
  • Multiple Communication interfaces including FlexRay, CAN, and LIN
  • NHET Timer and 2x 12-bit ADCs
  • External Memory Interface (EMIF)
    • 16bit Data, 22bit Address, 4 Chip Selects
  • Common TMS470/570 Platform Architecture
    • Consistent Memory Map across the family
    • Real-Time Interrupt (RTI) OS Timer
    • Vectored Interrupt Module (VIM)
    • Cyclic Redundancy Checker (CRC, 2 Channels)
  • Direct Memory Access (DMA) Controller
    • 32 DMA requests and 16 Channels/ Control Packets
    • Parity on Control Packet Memory
    • Dedicated Memory Protection Unit (MPU)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMzPLL)-Based Clock Module
    • Oscillator and PLL clock monitor
  • Up to 115 Peripheral IO pins
    • 16 Dedicated GIO - 8 w/ External Interrupts
    • Programmable External Clock (ECLK)
  • Communication Interfaces
    • Three Multi-buffered Serial Peripheral Interface (MibSPI) each with:
      • Four Chip Selects and one Enable pin
      • 128 buffers with parity
      • One with parallel mode
    • Two UART (SCI) interfaces with Local Interconnect Network Interface (LIN 2.0)
    • Three CAN (DCAN) Controller
      • Two with 64 mailboxes, one with 32
      • Parity on mailbox RAM
    • Dual Channel FlexRay™ Controller
      • 8K-Byte message RAM with parity
      • Transfer Unit with MPU and parity
  • High-End Timer (NHET)
    • 32 Programmable I/O Channels
    • 128 Words High-End Timer RAM with parity
    • Transfer Unit with MPU and parity
  • Two 12-Bit Multi-Buffered ADCs (MibADC)
    • 24 total ADC Input channels
    • Each has 64 Buffers with parity
  • Trace and Calibration Interfaces
    • Embedded Trace Module (ETMR4)
    • Data Modification Module (DMM)
    • RAM Trace Port (RTP)
    • Parameter Overlay Module (POM)
  • On-Chip emulation logic including IEEE 1149.1 JTAG, Boundary Scan and ARM Coresight components
  • Full Development Kit Available
    • Development Boards
    • Code Composer Studio Integrated Development Environment (IDE)
    • HaLCoGen Code Generation Tool
    • HET Assembler and Simulator
    • nowFlash Flash Programming Tool
  • Packages Supported
    • 144-Pin Quad Flat Pack (PGE) [Green]
    • 337-Pin Ball Grid Array (ZWT) [Green]
  • Community Resources
  • High-Performance Automotive Grade Microcontroller for Safety Critical Applications
    • Dual CPUs running in Lockstep
    • ECC on Flash and SRAM
    • CPU and Memory BIST (Built-In Self Test)
    • Error Signaling Module (ESM) w/ Error Pin
  • ARM® Cortex™-R4F 32-Bit RISC CPU
    • Efficient 1.6 DMIPS/MHz with 8-stage pipeline
    • Floating Point Unit with Single/Double Precision
    • Memory Protection Unit (MPU)
    • Open Architecture With Third-Party Support
  • Operating Features
    • Up to 160-MHz System Clock
    • Core Supply Voltage (VCC): 1.5 V
    • I/O Supply Voltage (VCCIO): 3.3 V
  • Integrated Memory
    • 1M-Byte or 2M-Byte Flash with ECC
    • 128K-Byte or 160K-Byte RAM with ECC
  • Multiple Communication interfaces including FlexRay, CAN, and LIN
  • NHET Timer and 2x 12-bit ADCs
  • External Memory Interface (EMIF)
    • 16bit Data, 22bit Address, 4 Chip Selects
  • Common TMS470/570 Platform Architecture
    • Consistent Memory Map across the family
    • Real-Time Interrupt (RTI) OS Timer
    • Vectored Interrupt Module (VIM)
    • Cyclic Redundancy Checker (CRC, 2 Channels)
  • Direct Memory Access (DMA) Controller
    • 32 DMA requests and 16 Channels/ Control Packets
    • Parity on Control Packet Memory
    • Dedicated Memory Protection Unit (MPU)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMzPLL)-Based Clock Module
    • Oscillator and PLL clock monitor
  • Up to 115 Peripheral IO pins
    • 16 Dedicated GIO - 8 w/ External Interrupts
    • Programmable External Clock (ECLK)
  • Communication Interfaces
    • Three Multi-buffered Serial Peripheral Interface (MibSPI) each with:
      • Four Chip Selects and one Enable pin
      • 128 buffers with parity
      • One with parallel mode
    • Two UART (SCI) interfaces with Local Interconnect Network Interface (LIN 2.0)
    • Three CAN (DCAN) Controller
      • Two with 64 mailboxes, one with 32
      • Parity on mailbox RAM
    • Dual Channel FlexRay™ Controller
      • 8K-Byte message RAM with parity
      • Transfer Unit with MPU and parity
  • High-End Timer (NHET)
    • 32 Programmable I/O Channels
    • 128 Words High-End Timer RAM with parity
    • Transfer Unit with MPU and parity
  • Two 12-Bit Multi-Buffered ADCs (MibADC)
    • 24 total ADC Input channels
    • Each has 64 Buffers with parity
  • Trace and Calibration Interfaces
    • Embedded Trace Module (ETMR4)
    • Data Modification Module (DMM)
    • RAM Trace Port (RTP)
    • Parameter Overlay Module (POM)
  • On-Chip emulation logic including IEEE 1149.1 JTAG, Boundary Scan and ARM Coresight components
  • Full Development Kit Available
    • Development Boards
    • Code Composer Studio Integrated Development Environment (IDE)
    • HaLCoGen Code Generation Tool
    • HET Assembler and Simulator
    • nowFlash Flash Programming Tool
  • Packages Supported
    • 144-Pin Quad Flat Pack (PGE) [Green]
    • 337-Pin Ball Grid Array (ZWT) [Green]
  • Community Resources

The TMS570LS series is a high performance automotive grade microcontroller family. The safety architecture includes Dual CPUs in lockstep, CPU and Memory Built-In Self Test (BIST) logic, ECC on both the Flash and the data SRAM, parity on peripheral memories, and loop back capability on peripheral IOs.

The TMS570LS family integrates the ARM® Cortex™-R4F Floating Point CPU which offers an efficient 1.6 DMIPS/MHz, and has configurations which can run up to 160 MHz providing more than 250 DMIPS. The TMS570LS series also provides different Flash (1MB or 2MB) and data SRAM (128KB or 160KB) options with single bit error correction and double bit error detection.

The TMS570LS devices feature peripherals for real-time control-based applications, including up to 32 nHET timer channels and two 12-bit A to D converters supporting up to 24 inputs. There are multiple communication interfaces including a 2-channel FlexRay, 3 CAN controllers supporting 64 mailboxes each, and 2 LIN/UART controllers.

With integrated safety features and a wide choice of communication and control peripherals, the TMS570LS series is an ideal solution for high performance real time control applications with safety critical requirements.

The devices included in the TMS570LS series and described in this document are:

  • TMS570LS20216
  • TMS570LS20206
  • TMS570LS10216
  • TMS570LS10206
  • TMS570LS10116
  • TMS570LS10106

The TMS570LS series microcontrollers contain the following:

  • Dual TMS570 16/32-Bit RISC (ARM Cortex™-R4F) in Lockstep
  • Up to 2M-Byte Program Flash with ECC
  • Up to 160K-Byte Static RAM (SRAM) with ECC
  • Real-Time Interrupt (RTI) Operating System Timer
  • Vectored Interrupt Module (VIM)
  • Cyclic Redundancy Checker (CRC) with Parallel Signature Analysis (PSA)
  • Direct Memory Access (DMA) Controller
  • Frequency-Modulated Phase-Locked Loop (FMzPLL)-Based Clock Module With Prescaler
  • Three Multi-buffered Serial Peripheral Interfaces (MibSPI)
  • Two UARTs (SCI) with Local Interconnect Network Interfaces (LIN)
  • Three CAN Controllers (DCAN)
  • High-End Timer (NHET) with dedicated Transfer Unit (HTU)
  • Available FlexRay Controller with dedicated PLL and Transfer Unit (FTU)
  • External Clock Prescale (ECP) Module
  • Two 16-Channel 12-Bit Multi-Buffered ADCs (MibADC) - 8 shared channels between the two ADCs
  • Address Bus Parity with Failure Detection
  • Error Signaling Module (ESM) with external error pin
  • Voltage Monitor (VMON) with out of range reset assertion
  • Embedded Trace Module (ETMR4)
  • Data Modification Module (DMM)
  • RAM Trace Port (RTP)
  • Parameter Overlay Module (POM)
  • 16 Dedicated General-Purpose I/O (GIO) Pins for ZWT; 8 Dedicated GIO Pins for PGE
  • 115 Total Peripheral I/Os for ZWT; 68 Total Peripheral I/Os for PGE
  • 16-Bit External Memory Interface (EMIF)

The devices utilize the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest numbered byte.

The device memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, halfword, and word modes. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3V supply input (same level as I/O supply) for all read, program and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 160 MHz.

The device has nine communication interfaces: three MibSPIs, two LIN/SCIs, three DCANs and one FlexRay™ controller (optional). The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0B protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 megabit per second (Mbps). The DCAN is ideal for applications operating in noisy and harsh environments (e.g., automotive and industrial fields) that require reliable serial communication or multiplexed wiring. The FlexRay uses a dual channel serial, fixed time base multimaster communication protocol with communication rates of 10 megabits per second (Mbps) per channel. A FlexRay Transfer Unit (FTU) enables autonomous transfers of FlexRay data to and from main CPU memory. Transfers are protected by a dedicated, built-in Memory Protection Unit (MPU).

The NHET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The NHET can be used for pulse width modulated outputs, capture or compare inputs, or general-purpose I/O. It is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High End Timer Transfer Unit (HET-TU) provides features to transfer NHET data to or from main memory. A Memory Protection Unit (MPU) is built into the HET-TU to protect against erroneous transfers.

The device has two 12-bit-resolution MibADCs with 24 total channels and 64 words of parity protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Eight channels are shared between the two ADCs. There are three separate groupings, two of which are triggerable by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The frequency-modulated phase-locked loop (FMzPLL) clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler. The function of the FMzPLL is to multiply the external frequency reference to a higher frequency for internal use. The FMzPLL provides one of the six possible clock source inputs to the global clock module (GCM). The GCM module provides system clock (HCLK), real-time interrupt clock (RTICLK1), CPU clock (GCLK), NHET clock (VCLK2), DCAN clock (AVCLK1), and peripheral interface clock (VCLK) to all other peripheral modules.

The device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency.

The Direct Memory Access Controller (DMA) has 32 DMA requests, 16 Channels/ Control Packets and parity protection on its memory. The DMA provides memory to memory transfer capabilities without CPU interaction. A Memory Protection Unit (MPU) is built into the DMA to protect memory against erroneous transfers.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt or external Error pin is triggered when a fault is detected.

The External Memory Interface (EMIF) provides a memory extension to asynchronous memories or other slave devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built in ARM Cortex™-R4F CoreSight™ debug features, an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port Module (RTP) is implemented to support high-speed output of RAM accesses by the CPU or any other master. A Direct Memory Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can re-route Flash accesses to the EMIF, thus avoiding the re-programming steps necessary for parameter updates in Flash.

The TMS570LS series is a high performance automotive grade microcontroller family. The safety architecture includes Dual CPUs in lockstep, CPU and Memory Built-In Self Test (BIST) logic, ECC on both the Flash and the data SRAM, parity on peripheral memories, and loop back capability on peripheral IOs.

The TMS570LS family integrates the ARM® Cortex™-R4F Floating Point CPU which offers an efficient 1.6 DMIPS/MHz, and has configurations which can run up to 160 MHz providing more than 250 DMIPS. The TMS570LS series also provides different Flash (1MB or 2MB) and data SRAM (128KB or 160KB) options with single bit error correction and double bit error detection.

The TMS570LS devices feature peripherals for real-time control-based applications, including up to 32 nHET timer channels and two 12-bit A to D converters supporting up to 24 inputs. There are multiple communication interfaces including a 2-channel FlexRay, 3 CAN controllers supporting 64 mailboxes each, and 2 LIN/UART controllers.

With integrated safety features and a wide choice of communication and control peripherals, the TMS570LS series is an ideal solution for high performance real time control applications with safety critical requirements.

The devices included in the TMS570LS series and described in this document are:

  • TMS570LS20216
  • TMS570LS20206
  • TMS570LS10216
  • TMS570LS10206
  • TMS570LS10116
  • TMS570LS10106

The TMS570LS series microcontrollers contain the following:

  • Dual TMS570 16/32-Bit RISC (ARM Cortex™-R4F) in Lockstep
  • Up to 2M-Byte Program Flash with ECC
  • Up to 160K-Byte Static RAM (SRAM) with ECC
  • Real-Time Interrupt (RTI) Operating System Timer
  • Vectored Interrupt Module (VIM)
  • Cyclic Redundancy Checker (CRC) with Parallel Signature Analysis (PSA)
  • Direct Memory Access (DMA) Controller
  • Frequency-Modulated Phase-Locked Loop (FMzPLL)-Based Clock Module With Prescaler
  • Three Multi-buffered Serial Peripheral Interfaces (MibSPI)
  • Two UARTs (SCI) with Local Interconnect Network Interfaces (LIN)
  • Three CAN Controllers (DCAN)
  • High-End Timer (NHET) with dedicated Transfer Unit (HTU)
  • Available FlexRay Controller with dedicated PLL and Transfer Unit (FTU)
  • External Clock Prescale (ECP) Module
  • Two 16-Channel 12-Bit Multi-Buffered ADCs (MibADC) - 8 shared channels between the two ADCs
  • Address Bus Parity with Failure Detection
  • Error Signaling Module (ESM) with external error pin
  • Voltage Monitor (VMON) with out of range reset assertion
  • Embedded Trace Module (ETMR4)
  • Data Modification Module (DMM)
  • RAM Trace Port (RTP)
  • Parameter Overlay Module (POM)
  • 16 Dedicated General-Purpose I/O (GIO) Pins for ZWT; 8 Dedicated GIO Pins for PGE
  • 115 Total Peripheral I/Os for ZWT; 68 Total Peripheral I/Os for PGE
  • 16-Bit External Memory Interface (EMIF)

The devices utilize the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest numbered byte.

The device memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, halfword, and word modes. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3V supply input (same level as I/O supply) for all read, program and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 160 MHz.

The device has nine communication interfaces: three MibSPIs, two LIN/SCIs, three DCANs and one FlexRay™ controller (optional). The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0B protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 megabit per second (Mbps). The DCAN is ideal for applications operating in noisy and harsh environments (e.g., automotive and industrial fields) that require reliable serial communication or multiplexed wiring. The FlexRay uses a dual channel serial, fixed time base multimaster communication protocol with communication rates of 10 megabits per second (Mbps) per channel. A FlexRay Transfer Unit (FTU) enables autonomous transfers of FlexRay data to and from main CPU memory. Transfers are protected by a dedicated, built-in Memory Protection Unit (MPU).

The NHET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The NHET can be used for pulse width modulated outputs, capture or compare inputs, or general-purpose I/O. It is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High End Timer Transfer Unit (HET-TU) provides features to transfer NHET data to or from main memory. A Memory Protection Unit (MPU) is built into the HET-TU to protect against erroneous transfers.

The device has two 12-bit-resolution MibADCs with 24 total channels and 64 words of parity protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Eight channels are shared between the two ADCs. There are three separate groupings, two of which are triggerable by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The frequency-modulated phase-locked loop (FMzPLL) clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler. The function of the FMzPLL is to multiply the external frequency reference to a higher frequency for internal use. The FMzPLL provides one of the six possible clock source inputs to the global clock module (GCM). The GCM module provides system clock (HCLK), real-time interrupt clock (RTICLK1), CPU clock (GCLK), NHET clock (VCLK2), DCAN clock (AVCLK1), and peripheral interface clock (VCLK) to all other peripheral modules.

The device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency.

The Direct Memory Access Controller (DMA) has 32 DMA requests, 16 Channels/ Control Packets and parity protection on its memory. The DMA provides memory to memory transfer capabilities without CPU interaction. A Memory Protection Unit (MPU) is built into the DMA to protect memory against erroneous transfers.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt or external Error pin is triggered when a fault is detected.

The External Memory Interface (EMIF) provides a memory extension to asynchronous memories or other slave devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built in ARM Cortex™-R4F CoreSight™ debug features, an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port Module (RTP) is implemented to support high-speed output of RAM accesses by the CPU or any other master. A Direct Memory Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can re-route Flash accesses to the EMIF, thus avoiding the re-programming steps necessary for parameter updates in Flash.

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技術資料

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート TMS570LS Series 16/32-BIT RISC Flash Microcontroller データシート (Rev. G) PDF | HTML 2018年 10月 24日
* エラッタ TMS570LS20216/20206/10216/10206/10116/10106 MCU Silicon Errata (Silicon Rev A) (Rev. D) 2011年 6月 30日
* ユーザー・ガイド TMS570LS20x/10x Series Technical Reference Manual (Rev. C) 2012年 2月 15日
ユーザー・ガイド Hercules Diagnostic Library CSP Without LDRA 2019年 10月 29日
その他の技術資料 Diagnostic Library CSP Release Notes 2019年 10月 17日
アプリケーション・ノート HALCoGen Ethernet Driver With lwIP Integration Demo and Active Webserver Demo PDF | HTML 2019年 9月 13日
アプリケーション・ノート CAN Bus Bootloader for Hercules Microcontrollers PDF | HTML 2019年 8月 21日
アプリケーション・ノート Hercules AJSM Unlock (Rev. A) PDF | HTML 2016年 10月 19日
アプリケーション・ノート Sine Wave Generation Using PWM With Hercules N2HET and HTU 2015年 5月 12日
アプリケーション・ノート Triangle/Trapezoid Wave Generation Using PWM With Hercules N2HET 2015年 5月 1日
その他の技術資料 HaLCoGen Release Notes 2014年 6月 25日
ユーザー・ガイド nowECC Generation Tool User's Guide v2.22 (Rev. D) 2014年 4月 8日
アプリケーション・ノート Interfacing TPS65381 With Hercules Microcontrollers (Rev. A) 2014年 2月 14日
ユーザー・ガイド TMS470/570 Platform F035 Flash API Reference Guide v1.09 (Rev. E) 2014年 2月 6日
アプリケーション・ノート Basic PBIST Configuration and Influence on Current Consumption (Rev. C) 2012年 4月 12日
アプリケーション・ノート Verification of Data Integrity Using CRC 2012年 2月 17日
アプリケーション・ノート FlexRay Transfer Unit (FTU) Setup 2012年 1月 26日
ユーザー・ガイド HET Integrated Development Environment User's Guide (Rev. A) 2011年 11月 17日
機能安全情報 Important ARM Ltd Application Notes for TI Hercules ARM Safety MCUs 2011年 11月 17日
アプリケーション・ノート Interfacing the Embedded 12-Bit ADC in a TMS570LS20x/10x Series Device (Rev. A) 2011年 11月 6日
機能安全情報 Execution Time Measurement for Hercules ARM Safety MCUs (Rev. A) 2011年 11月 4日
アプリケーション・ノート Compatibility Considerations: TMS570LS20x/10x to TMS570LS31x/21x (Rev. A) 2011年 10月 20日
アプリケーション・ノート 3.3 V I/O Considerations for Hercules Safety MCUs (Rev. A) 2011年 9月 6日
機能安全情報 Hercules ARM セーフティ MCU の A/D コンバータの信号源インピーダンスについて (Rev. B) 2011年 9月 6日
機能安全情報 Hercules ARM セーフティー MCU の CAN ノードの設定について 2011年 9月 6日
機能安全情報 Leveraging the High-End Timer Transfer Unit on Hercules ARM Safety MCUs (Rev. A) 2011年 9月 6日
機能安全情報 UART 通信のための Hercules ARM セーフティー MCU SCI/LIN モジュールの設定について (Rev. A) 2011年 9月 6日
アプリケーション・ノート ECC handling in TMSx70 based microcontrollers 2011年 2月 23日
ユーザー・ガイド TI ICEPick Module Type C Reference Guide Public Version 2011年 2月 17日
アプリケーション・ノート NHET Getting Started (Rev. B) 2010年 8月 30日
アプリケーション・ノート Programming TMS570LS20x/10x Flash Using Flash API (Rev. A) 2010年 5月 27日
機能安全情報 Usage of MPU Subregions on TI Hercules ARM Safety MCUs 2010年 3月 10日
アプリケーション・ノート Use of Flash Test Pins on TMSx70 F035 Devices (Rev. A) 2010年 3月 10日
ユーザー・ガイド TI Assembly Language Tools Enhanced High-End Timer (NHET) Assembler User's Guide 2010年 3月 4日
アプリケーション・ノート TMS570LS20x/10x のための推奨イニシャライズコード 2010年 3月 4日
ホワイト・ペーパー Discriminating between Soft Errors and Hard Errors in RAM White Paper 2008年 6月 4日

設計と開発

その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。

IDE (統合開発環境)、コンパイラ、またはデバッガ

CCSTUDIO Code Composer Studio 統合開発環境(IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

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開始 ダウンロードオプション
シミュレーション・モデル

TMS570LS20216 PGE IBIS Model

SPNM016.ZIP (247 KB) - IBIS Model
シミュレーション・モデル

TMS570LS20216 ZWT IBIS Model

SPNM015.ZIP (249 KB) - IBIS Model
パッケージ ピン数 ダウンロード
LQFP (PGE) 144 オプションの表示
NFBGA (ZWT) 337 オプションの表示

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 材質成分
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報:
  • ファブの拠点
  • 組み立てを実施した拠点

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