Configuration1:1 SPSTNumber of channels (#)4Power supply voltage - single (V)1.8, 2.5, 3.3Ron (Typ) (Ohms)0.7ON-state leakage current (Max) (µA)0.005Bandwidth (MHz)125Operating temperature range (C)-40 to 85FeaturesSupports SPI signals, Supports JTAG signalsInput/output continuous current (Max) (mA)100RatingCatalogCON (Typ) (pF)43Supply current (Typ) (uA)2.5open-in-newその他の アナログ・スイッチ/マルチプレクサ
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel
TIDA-010032 — IPv6-based grid communications are becoming the standard choice in industrial markets and applications like smart meters and grid automation. The universal data concentrator design provides a complete IPv6-based network solution integrated with Ethernet backbone communication, 6LoWPAN RF mesh (...)