ProtocolsRGB, CompositeConfiguration2:1 SPDTNumber of channels (#)4Bandwidth (MHz)500Supply voltage (Max) (V)3.6Supply voltage (Min) (V)3Ron (Typ) (Ohms)3Input/ouput voltage (Min) (V)0Input/ouput voltage (Max) (V)5.5Supply current (Typ) (uA)700ESD HBM (Typ) (kV)2Operating temperature range (C)-40 to 85Crosstalk (dB)-80ESD CDM (kV)1ICC (Typ) (uA)700Input/output continuous current (Max) (mA)128COFF (Typ) (pF)3.5CON (Typ) (pF)10.5Off isolation (Typ) (dB)-60OFF-state leakage current (Max) (µA)1Propagation delay (ns)2Ron (Max) (Ohms)6RON flatness (Typ) (Ohms)1Turn off time (disable) (Max) (ns)7Turn on time (enable) (Max) (ns)7VIH (Min) (V)2VIL (Max) (V)0.8open-in-newその他の プロトコル固有のスイッチ/マルチプレクサ
The TI video switch TS3V340 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN)\ input. When EN\ is low, the switch is enabled and the D port is connected to the S port. When EN\ is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.
Low differential gain and phase makes this switch ideal for composite and RGB video applications. The device
has a wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.
To ensure the high-impedance state during power up or power down, EN\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel