ProtocolsAnalog AudioConfiguration2:1 SPDTNumber of channels (#)2Bandwidth (MHz)18.3Supply voltage (Max) (V)5.5Supply voltage (Min) (V)2.3Ron (Typ) (Ohms)0.52Input/ouput voltage (Min) (V)-3.2Input/ouput voltage (Max) (V)5.5Supply current (Typ) (uA)0.1ESD HBM (Typ) (kV)1.5Operating temperature range (C)-40 to 85Crosstalk (dB)-78ESD CDM (kV)1.5Input/output continuous current (Max) (mA)350CON (Typ) (pF)370Off isolation (Typ) (dB)-70Ron (Max) (Ohms)1.3Ron channel match (Max) (Ohms)0.3Turn on time (enable) (Max) (ns)120VIH (Min) (V)1.4VIL (Max) (V)0.8open-in-newその他の プロトコル固有のスイッチ/マルチプレクサ
The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel