Configuration1:1 SPSTNumber of channels (#)1Power supply voltage - single (V)1.8, 2.5, 3.3, 5Ron (Typ) (Ohms)0.7ON-state leakage current (Max) (µA)0.02Bandwidth (MHz)200Operating temperature range (C)-40 to 85FeaturesBreak-before-makeInput/output continuous current (Max) (mA)200RatingCatalogCON (Typ) (pF)36.5Supply current (Typ) (uA)0.001open-in-newその他の アナログ・スイッチ/マルチプレクサ
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel
TIDA-01014 — The Internet of Things (IoT) revolution is efficiently connecting applications and instruments, enabling battery powered, wide scale very low power sensor deployment. New technologies, such as TI’s advanced sensor and low power connectivity devices, are enabling these instruments to be (...)