The AUP family is TIs premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.
The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
|Part number||オーダー・オプション||Technology Family||VCC (Min) (V)||VCC (Max) (V)||Channels (#)||IOL (Max) (mA)||IOH (Max) (mA)||ICC (uA)||Input type||Output type||Features||Data rate (Mbps)||Rating||Package Group|
Very high speed (tpd 5-10ns)
Partial power down (Ioff)
Over-voltage tolerant inputs
DSBGA | 8
UQFN | 8
VSSOP | 8
X2SON | 8