Product details

Sample rate (max) (Msps) 1000, 2000 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2800 Features Ultra High Speed Rating Catalog Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3380 Architecture Folding Interpolating SNR (dB) 60.2 ENOB (bit) 9.6 SFDR (dB) 71 Operating temperature range (°C) -40 to 85 Input buffer Yes
Sample rate (max) (Msps) 1000, 2000 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2800 Features Ultra High Speed Rating Catalog Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3380 Architecture Folding Interpolating SNR (dB) 60.2 ENOB (bit) 9.6 SFDR (dB) 71 Operating temperature range (°C) -40 to 85 Input buffer Yes
PBGA (NXA) 292 729 mm² 27 x 27
  • Configurable to Either 2.0/3.2 GSPS Interleaved
    or 1.0/1.6 GSPS Dual ADC
  • Pin-Compatible With ADC10D1x00 and
    ADC12D1x00
  • Internally Terminated, Buffered, Differential
    Analog Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Programmable 15-bit Gain and 12-bit Plus Sign
    Offset
  • Programmable tAD Adjust Feature
  • 1:1 Non-demuxed or 1:2 Demuxed LVDS Outputs
  • AutoSync Feature for Multi-Chip Systems
  • Single 1.9-V ± 0.1-V Power Supply
  • Configurable to Either 2.0/3.2 GSPS Interleaved
    or 1.0/1.6 GSPS Dual ADC
  • Pin-Compatible With ADC10D1x00 and
    ADC12D1x00
  • Internally Terminated, Buffered, Differential
    Analog Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Programmable 15-bit Gain and 12-bit Plus Sign
    Offset
  • Programmable tAD Adjust Feature
  • 1:1 Non-demuxed or 1:2 Demuxed LVDS Outputs
  • AutoSync Feature for Multi-Chip Systems
  • Single 1.9-V ± 0.1-V Power Supply

The 12-bit, 2.0/3.2 GSPS ADC12D1x00 device is the latest advance in TI’s Ultra High-Speed ADC family and builds upon the features, architecture, and functionality of the 10-bit GHz family of ADCs.

The ADC12D1x00 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common-mode voltage.

The ADC12D1x00 is packaged in a leaded or lead-free 292-pin thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

The 12-bit, 2.0/3.2 GSPS ADC12D1x00 device is the latest advance in TI’s Ultra High-Speed ADC family and builds upon the features, architecture, and functionality of the 10-bit GHz family of ADCs.

The ADC12D1x00 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common-mode voltage.

The ADC12D1x00 is packaged in a leaded or lead-free 292-pin thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

Download View video with transcript Video

Technical documentation

Design & development

Please view the Design & development section on a desktop.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos