ProtocolsAnalog AudioConfigurationCrosspoint/exchangeNumber of channels (#)2Supply voltage (Max) (V)3.6Supply voltage (Min) (V)3Ron (Typ) (Ohms)0.08Input/ouput voltage (Min) (V)0Input/ouput voltage (Max) (V)3.6Supply current (Typ) (uA)40ESD HBM (Typ) (kV)2Operating temperature range (C)-40 to 85ESD CDM (kV)0.5ICC (Typ) (uA)40Input/output continuous current (Max) (mA)100OFF-state leakage current (Max) (µA)0.5Propagation delay (ns)10Ron (Max) (Ohms)0.11RON flatness (Typ) (Ohms)1Turn off time (disable) (Max) (ns)10Turn on time (enable) (Max) (ns)200VIH (Min) (V)1.2VIL (Max) (V)0.4open-in-newその他の プロトコル固有のスイッチ/マルチプレクサ
The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch.
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel