Configuration2:1 SPDTNumber of channels (#)2Power supply voltage - single (V)1.8, 2.5, 3.3Ron (Typ) (Ohms)0.45ON-state leakage current (Max) (µA)0.06Bandwidth (MHz)80Operating temperature range (C)-40 to 85FeaturesBreak-before-make, Supports I2C signals, 1.8-V compatible control inputsInput/output continuous current (Max) (mA)300RatingCatalogCON (Typ) (pF)115Supply current (Typ) (uA)150open-in-newその他の アナログ・スイッチ/マルチプレクサ
The TS3A5223 is a high-speed 2-channel analog switch with break-before-make and bi-directional signal switching capability. The TS3A5223 can be used as a dual 2:1 multiplexer or a 1:2 dual de-multiplexer.
The TS3A5223 offers very low ON resistance, very low THD, channel-to-channel crosstalk and very high OFF isolation. These features make TS3A5223 suitable for application in Audio signal routing and switching applications.
The TS3A5223 control logic supports 1 V – 3.6 V CMOS logic levels. The logic interface allows direct interface with a wide range of CPUs and microcontrollers without increasing the current drawn from supply (ICC) and thus lowering power consumption.
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel