ProtocolsAnalog AudioConfiguration2:1 SPDTNumber of channels (#)2Bandwidth (MHz)18.3Supply voltage (Max) (V)5.5Supply voltage (Min) (V)2.3Ron (Typ) (Ohms)0.52Input/ouput voltage (Min) (V)-3.2Input/ouput voltage (Max) (V)5.5Supply current (Typ) (uA)0.1ESD HBM (Typ) (kV)2.5Operating temperature range (C)-40 to 85Crosstalk (dB)-78ESD CDM (kV)1.5Input/output continuous current (Max) (mA)350COFF (Typ) (pF)70CON (Typ) (pF)370Off isolation (Typ) (dB)-68OFF-state leakage current (Max) (µA)0.375Ron (Max) (Ohms)1.3Ron channel match (Max) (Ohms)0.15Turn on time (enable) (Max) (ns)120VIH (Min) (V)1.4VIL (Max) (V)0.8open-in-newその他の プロトコル固有のスイッチ/マルチプレクサ
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Quick testing of TI's surface mount packages
Allows suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 16 most popular leadless packages with a single panel